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Issue #7/2024
S.S. Kogan
High-capacity transport FOTS. Part 3. Evolution of technologies for manufacturing coherent DSPs
High-capacity transport FOTS. Part 3. Evolution of technologies for manufacturing coherent DSPs
DOI: 10.22184/2070-8963.2024.123.7.66.71
This series of papers presents international industry standards for 400G open line interfaces with interchangeable coherent optical transceiver modules (transceivers) for OTN/DWDM transport fiber optic transmission systems (Part 1), evolution of generations of coherent digital signal processors (DSPs) for high-speed optical channels (wavelengths) in FOTS (Part 2), and evolution of technologies for manufacturing coherent DSPs for FOTS (Part 3).
This series of papers presents international industry standards for 400G open line interfaces with interchangeable coherent optical transceiver modules (transceivers) for OTN/DWDM transport fiber optic transmission systems (Part 1), evolution of generations of coherent digital signal processors (DSPs) for high-speed optical channels (wavelengths) in FOTS (Part 2), and evolution of technologies for manufacturing coherent DSPs for FOTS (Part 3).
Теги: chip miniaturisation signal processor transceiver transimpedance amplifiers миниатюризация чипов сигнальный процессор трансивер трансимпедансные усилители
High-capacity transport FOTS. Part 3. Evolution of technologies for manufacturing coherent DSPs
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