rus
Issue #8/2024
S.S.Kogan
High-capacity transport FOTS. Part 3. Evolution of technologies for manufacturing coherent DSPs. The end
High-capacity transport FOTS. Part 3. Evolution of technologies for manufacturing coherent DSPs. The end
DOI: 10.22184/2070-8963.2024.124.8.68.73
This series of papers presents international industry standards for 400G open line interfaces with interchangeable coherent optical transceiver modules (transceivers) for OTN/DWDM transport fiber optic transmission systems (Part 1), evolution of generations of coherent digital signal processors (DSPs) for high-speed optical channels (wavelengths) in FOTs (Part 2), and evolution of technologies for manufacturing coherent DSPs for FOTs (Part 3).
This series of papers presents international industry standards for 400G open line interfaces with interchangeable coherent optical transceiver modules (transceivers) for OTN/DWDM transport fiber optic transmission systems (Part 1), evolution of generations of coherent digital signal processors (DSPs) for high-speed optical channels (wavelengths) in FOTs (Part 2), and evolution of technologies for manufacturing coherent DSPs for FOTs (Part 3).
Теги: 2nm process bpdn bpdn technologies cfet transistors epitaxy gaa silicon atom silicon processor limit transceiver атом кремния предел кремниевых процессоров технологии gaa техпроцесс 2 нм транзисторы cfet трансивер эпитаксия
High-capacity transport FOTS. Part 3. Evolution of technologies for manufacturing coherent DSPs. The end
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